Please use this identifier to cite or link to this item: http://localhost:8080/xmlui/handle/123456789/3997
Title: Fillers in Wood Adhesives
Authors: Faris, Abbas Hasan
Keywords: Bonding strength, OF, wheat flour, tannin adhesive, organoclay
Issue Date: 2021
Publisher: Intechopen
Abstract: The introduction of a second component to polymers has been presented; this component is often used to modify the characteristics of the products and to acquire new polymer materials with improved properties. Composite materials have a pivotal role in industries that are now considered the most progressive worldwide. At present, synthetic adhesives based on formaldehyde such as phenol-formaldehyde (PF), urea formaldehyde (UF), and melamine formaldehyde (MF) are predominantly used for wood composite production, and these adhesives are commonly used in the wood panel industry. These adhesives have some advantages and disadvantages. The use of PF adhesives is as important as UF adhesives in the wood panel industry. However, their application is still limited because of its brittleness, brown color, high curing temperature, long curing time, and toxicity due to liberation of phenol and formaldehyde. A variety of methods have been used to improve the performance of UF and PF adhesives as well as to expand their use. These methods are widely used in the industry; they include the simple addition of fillers. Moreover, the addition of fillers could reduce shrinkage and alleviate the stress on the glue line, which improves the hardness and durability.
URI: http://localhost:8080/xmlui/handle/123456789/3997
Appears in Collections:الهندسة الكيميائية والبتروكيميائية

Files in This Item:
File Description SizeFormat 
Abstract..pdf5.67 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.